IPC/JEDEC J-STDC. Handling, Packing,. Shipping and Use of. Moisture/ Reflow. Sensitive Surface. Mount Devices. A joint standard. IPC/JEDEC J-STDC-1 -. August IPC/JEDEC J-STDC -. February IPC/JEDEC J-STDB.1 includes Amendment 1 -. complies with ipc/JEDEc J-stDA. 3M™ HIC this card meets the IPC /JEDEC J-STD-. A standard. card size: 2” x 3” inches indicates: 5,10,15%.

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These methods help avoid damage from moisture absorption and exposure to solder reflow temperatures that can result in yield and reliability degradation. Approved options include clay and silica gel. Please first log in with a verified email before subscribing to alerts.

Already Subscribed to this document. Figures 1 and 2. The company compared three moisture measurement techniques: Your Alert Profile lists the documents that will be monitored. Effectiveness of desiccant on moisture absorption of packaged connectors.

In this stage, the higher liquidus temperatures required for lead-free solders may have a profound effect on the connector insulator housings.

You may delete a document from your Alert Profile at any time. For standard MBB sizes used for shipping connectors loose or on reels the amount of desiccant required is less than two units.

Some materials currently used may deform melt or show signs of delamination on the side walls, referred to as “blistering. You can download and open this file to your own computer but DRM prevents opening this file on another computer, including a networked server. This standard is also available to be included in Standards Subscriptions. The company has analyzed the types of bags that are available for connector packaging and come up with some recommendations based upon WVTR ratings Table 2.


This standard is not included in any packages. Many connector suppliers are eliminating, or have already eliminated, lead from their contact plating process.

This delamination is commonly referred to as a “blister. The next phase will be lead-free solder compliance for board assembly. Key to elimination of blistering is moisture control for most of the temperature-capable engineering resins used in connector housings. Higher temperatures required for lead-free SMT soldering will force a change from many currently used connector housing resins, which will melt, suffer pin retention failures or fail to meet dimensional stability requirements.

By using these procedures, safe and damage-free reflow can be achieved with the dry packing process, providing a minimum shelf life of 12 months from the seal date when using sealed dry jedsc.

Minimizing Effects of Lead-free SMT Assembly on Connector Housing Resins

The higher preheat temperatures typical in lead-free solder profiles may provide more safety from blistering for thinner-walled parts than current tin-lead solder profiles due to the direct relationship between moisture desorption rate and temperature. Proceed to Checkout Continue Shopping. BoxEvansville, IN; Fax: If the document is revised or amended, you will be notified by email.

Blister onset temperature is dependent upon several factors, including wall thickness, percentage of moisture in the part, speed of connector heating, and peak temperature of the reflow process. Board assemblers have focused on handling more expensive ICs but have failed to take similar precautions with board connectors.

We have no amendments or corrections for this standard. MBBs in two different thicknesses 0. Subscription pricing is determined by: As the voice of the U.

The key parameter in blistering of connector housings is the control of moisture absorption in the molded parts. But the problems listed previously for connectors in these hot oven environments can also result in board rework.


J-STD Bake Conditions

The vapor pressure of moisture and other gases trapped inside the walls of a plastic connector increase rapidly when the connector is exposed to the high temperatures of solder reflow. Many Asian OEMs, who have been converting to the lead-free solder process for the last few years, require that their connectors be packaged to minimize moisture absorption for this reason.

If all ztd absorption precautions are taken and connectors are still exhibiting some delamination during SMT assembly, measuring the amount of moisture in the parts to determine the steps required to solder without connector blistering may be required.

Standards Subscriptions from ANSI provides a money-saving, multi-user solution for accessing standards.

CARD, HUMIDITY INDICATOR, 5% 10% 15% RH, J-STDA | Arbell Electronics Distributor

The higher the peak temperature, the lower the moisture content can be before blistering. For ease of use, the halogen moisture analyzer was considered the best.

Table 3 shows that, at the storage conditions of an air-conditioned warehouse in Southeast Asia Condition 1even the thinnest tested LDPE bag would provide enough moisture protection to keep the connectors below the blister threshold level for 90 days. Lead-free solders result in higher peak temperatures, meaning more blistering. They were subjected 033a two different storage conditions: Please first verify your email before subscribing to alerts.