GEIA HB 0005 2 PDF

Buy GEIA HB (R) Technical Guidelines For Aerospace And High Performance Electronic Systems Containing Lead-Free Solder And Finishes. Find the most up-to-date version of GEIA-STD at Engineering TechAmerica GEIA-HB Technical Guidelines for Aerospace and High Performance Electronic Systems Containing Lead-Free Solder.

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An additional test vehicle had been designed, based on a PCB with 24 SOIC14 packages, assembled using range of gsia, to enable testing for short circuits between adjacent leads on individual component. Standards Subsctiption may be the perfect solution.

Tin Whisker Mitigation Methodologies: Report from SMART Group, Part 1

But how do hhb set about mitigating against such failure where the use of pure tin finished components is unavoidable? Furthermore, the guide highlights Pb-free concerns, gb they are encountered in the phases which generally reflect the product development cycle used by Aerospace, Defense, and High-Performance systems industries.

Your Alert Profile lists the documents that will be monitored. No, the group members 00005 not all have curly hair! On behalf of ESA, a working group led by Dr Dunn had produced a comprehensive set of guidelines for creating a lead-free control plan, which described the problems, requirements and methods relevant to the preparation of a plan for companies to control against the use of lead-free components and to ensure that pure tin did not find its way into the manufacturing chain.

Subscription pricing is determined by: Please first log in with a verified email before subscribing to alerts. With a heavy dependence on COTS to maintain a competitive edge, the industry is heavily influenced by the commercial supply chain and its increasing use of Pb-free materials.

Summarizing at a high level, these challenges represent risks associated with 1 durability of the interconnection and geiia deleterious effects of tin whiskers. The plan included a list of tasks necessary to provide ADHP engineers sufficient information to minimize risks associated with Pb-free solders and finishes. Pulse plating could be used as a means of manipulating the grain structure and orientation of the tin deposit, and in some instances showed reduced whisker growth 00005 with direct current deposits.


This paper presents a summary of efforts from document inception to document release. Using the analogue of two sword-fencers for illustration, Wickham explained different failure modes: A remarkable observation was that in some instances it could be 00005 years before whiskers began to grow, depending on the substrate and stress level. This standard is not included in any packages.

Tin Whisker Mitigation Methodologies: Report from SMART Group, Part 1

The defining standard for tin whisker susceptibility of tin and tin alloy surface finishes was JEDEC JESDA, an accelerated test used by component manufacturers, but there was some doubt as to the reliability of results since tin whiskering was such an unpredictable phenomenon. The higher current densities tended to favour the formation of large eruptions, rather than filament whiskers. Consequently, manufacturers of high-reliability electronics with RoHS exemption were left with no alternative but to manage tin-lead obsolescence by avoidance or mitigation.

The factors influencing whisker growth were electroplating bath chemistry, whether pure tin geiia a tin alloy, 0005 or matte, electroplating parameters such as current density, temperature and agitation, and substrate, taking copper, brass and beia 42 as examples.

But, because of RoHS legislation, increasing numbers of components were only available with pure tin finishes.

While considerable progress has been made in closing Pb-free knowledge gaps, the challenge of characterizing performance and reliability still needs to be addressed. He gfia on to discuss the detail requirements of Levels 2B, 2C and 3, with particular reference to the use of conformal coatings to form a geeia barrier. A Circuitnet Media Publication. Since the introduction of the RoHS legislation inthe threat of tin-whisker-related short circuit failure from pure tin finished components has remained a major concern within the high-reliability electronics manufacturing industry.


geia std 2 pdf – P(1) –

The assemblies were constantly monitored at a test voltage of 15 volts with a series resistor to limit current to 15 milliamps. Other viable mitigation practices were hot-dip tinning for structural steel parts, or hot-oil fused tin plating. Plated brass, tin-plated brass with a copper barrier layer, tin plated steel, hg steel with a copper barrier layer, all displayed their own characteristics, sometimes predictable, sometimes not, but fused tin plating showed no whisker nucleation on any of these substrates during the 32 years of the study.

He showed several examples of actual failures, and other instances where whiskers had grown but geix yet been detected electrically.

In a recent SMT survey, we asked the following question: Strategies were now based on protective barriers, re-finishing of component terminations, and automatic coverage of pure tin finished surfaces by tin-lead solder during the assembly process. He distributed copies to delegates, and gdia is available on-line for free download by clicking here.

Charles Cawthorne then introduced Dr Mark Ashworth of Loughborough University, who discussed the effect of plating methodologies, the first of two presentations describing research carried out at Loughborough into mechanisms and strategies for tin whisker mitigation. Some key resources include the following set of standards and handbooks developed for working with Pb-free materials in various electronics applications: Using a tin plating process deliberately chosen for it high propensity to whiskering, NPL had developed a parallel plate test vehicle that had been enabled electrical detection of failure.

Engineers will need to “act like engineers” in order to comprehend this information and apply it to their needs.