The company has grown since then to more than employees today. Our products help increase production efficiency, optimize processes and. The microDICE™ laser micromachining system leverages TLS-Dicing™.
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A main aspect in technological developments for photovoltaics is the reduction of cost per power of the solar panel.
3D-Micromac – Our Headquarter in Chemnitz, Germany
The different processing methods that are realized with our laser systems include micro drilling, signing, cutting, 2D and 3D structuring, welding as well as marking of different materials and thin films. What is our motivation? Winner of the Saxon Innovation Prize We are one of the first companies in the world to focus on the use of ultra-short pulse lasers for the processing of materials.
More-than-Moore MtMSystem-in-Package SiPas well as 3D high-density integration technologies are a prerequisite for enabling the design of compact microelectronic devices e.
Target of this mucromac is to explore and to develop new diagnostic tools and advanced methods for material characterization, defect localization, efficient sample preparation, physical failure analysis techniques and workflows to enable reliable advanced micro-systems based on MtM, SiP, and 3D technologies for European core applications. Our expertise and engineering competency allow us to stand alongside our customers as reliable partners in technology and process development as well as in the development of OEM-manufacturing solutions and customer-specific systems.
For this reason, 3D-Micromac continuously works on innovative laser processes and solutions for optimizing manufacturing processes, productivity, and effectiveness of silicon solar cells. Wir verwenden Cookies, um Mciromac und Anzeigen zu personalisieren und die Zugriffe auf unsere Website zu analysieren.
Contact – Laser Micromachining – 3D-Micromac AG
For the past 16 years, the name 3D-Micromac AG stands for highest quality and satisfied customers. As a further challenge, laser cutting and structuring processes are developed mkcromac substrate separation and interconnection. Laser processing on-the-fly and an innovative handling concept enable maximum throughput and yield in the mass production of crystalline solar cells.
Our aim is to provide superb customer satisfaction even for the most complex projects.
This immensely helps to reduce ramp-up times in production. Therefore, we are very proud to be certified to the ISO quality standard since Our products help increase production efficiency, optimize processes and lower costs in various areas of technology. From the founding of our company until today we have constantly been able to achieve important milestones:. We Optimize your Processes!
At the end of the project a throughput of Wafer micromca hour should be reached. This has created a greater need for methods of processing surface layers of the device without affecting buried structures, as well as selective exposure of functional areas on the device.
This is particularly true for silicon carbide SiC substrates, which are hard and brittle. The on-the-fly processing guarantees highest productivity and an outstanding price-performance ratio. Its high throughput, outstanding edge quality and mm wafer capable platform enables a true high-volume production process, especially for SiC-based devices. Furthermore a technology for cutting solar cells is especially interesting for national producers of special solar modules who can use it for the production of special formed modules.
In its strategic alignment 3D-Micromac concentrates particularly on international and high-growth, high-tech markets. More than excimer laser systems produced by 3D-Micromac AG are currently in industrial use. These proprietary technology innovations are now readily available on a worldwide scale. Successful market launch of production systems for the manufacturing of nozzles via excimer-laser By constantly optimizing all internal mixromac processes, we set the course for the steady growth of our company and for a lasting partnership with our customers and suppliers.
Excellent Support and Service. If you continue to use this site we 3x assume that you are happy with it. We focus on laser micromachining of virtually any material using short-pulse and ultra-short pulse lasers as well as short wave lasers UV. This should lead to an increased lifetime of mkcromac solar modules. Development of industrial-suited excimer-laser system for marking of ophthalmic lenses Therefore TLS is a micrmoac approach as TLS dicing works without remove of material and create a mjcromac cut nearly without deterioration.
It is only because of our laser processes that efficient series production of new and innovative components and products are made possible. We develop processes, machines and turnkey solutions at the highest technical and technological level.
They are characterized by extraordinary reliability and productivity, fine precision, and flexibility. Some of the technologies are being researched in cooperation with cooperation partners from the partner cluster in Yonezawa, Japan.
Thereto the project part of 3D-Micromac will provide an important contribution: Through dividing the solar cells in half cells before integrating in modules microjac losses can be reduced. As a result of the project, demonstrators are being developed that illustrate 33d power of the micromca. This project has received funding from the Federal Ministry of Education and Research under grant agreement no [16ES].
The certification covers the entire spectrum of development, production, sales and service of our machines, plants and technologies. In addition work will directed to efficient protective coatings for the OLEDs as well as to transparent electrical contacts which give added value to the lighting market. Cost, quality and throughput are major factors in achieving successful manufacturing in the semiconductor industry. Setting Worldwide Standards in Laser Micromachining.
Micrkmac the growing adoption of new types of wafer substrates, thinner wafers and scaling to smaller dimensions and larger-size substrates, wafer dicing is evolving as a critical value-add process step that not only ensures, but also further enhances, semiconductor device yields.
Microdiagnostics and Failure Analysis.